Systems and methods for pulse width modulated dose control
US11834736B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 2, 2023 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Jan 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system for treating a substrate includes a manifold, a plurality of injector assemblies located in a processing chamber, and a dose controller. Each of the plurality of injector assemblies is in fluid communication with the manifold and includes a valve including an inlet and an outlet. The dose controller is configured to communicate with the valve in each of the plurality of injector assemblies. The dose controller is configured to adjust a pulse width supplied to the valve in each of the plurality of injector assemblies to provide spatial dosing and at least one of compensate for upstream skew caused by a prior process and pre-compensate for downstream skew expected from a subsequent process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.