Substrate handling device with adjustable joints
US11837494B2 · kind B2 · utility
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2,210References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Oct 7, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G47/915
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.