Substrate with variable height conductive and dielectric elements
US11837534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2017 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Dec 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49822
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses, systems and methods associated with package substrate design with variable height conductive elements within a single layer are disclosed herein. In embodiments, a substrate may include a first layer, wherein a trench is located in the first layer, and a second layer located on a surface of the first layer. The substrate may further include a first conductive element located in a first portion of the second layer adjacent to the trench, wherein the first conductive element extends to fill the trench, and a second conductive element located in a second portion of the second layer, wherein the second conductive element is located on the surface of the first layer. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.