Semiconductor device package and a method of manufacturing the same
US11837557B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
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Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Feb 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.