Po-Wei LU
8Patents
1h-index
11Co-inventors
40Inventor score
Filing activity: Mar 7, 2014 → Nov 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11037853B1 | Semiconductor package structure and method of manufacturing the same | Electricity | 2 | Active |
| US11189576B2 | Semiconductor device package and a method of manufacturing the same | Electricity | 0 | Active |
| US11837557B2 | Semiconductor device package and a method of manufacturing the same | Electricity | 0 | Active |
| US10453764B2 | Molding for large panel fan-out package | Electricity | 0 | Active |
| US8952464B2 | MEMS apparatus | Performing Operations; Transporting | 0 | Active |
| US9018771B2 | Thin film apparatus | Electricity | 0 | Active |
| US12107056B2 | Semiconductor device package and the method of manufacturing the same | Electricity | 0 | Active |
| US9544695B2 | MEMS microphone device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.