Polishing apparatus
US11839948B2 · kind B2 · utility
0Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2019 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Apr 28, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.