Wafer inspection method and inspection apparatus
US11841381B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2022 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Sep 22, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2868
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.