Patent · US Active

Electronic systems with inverted circuit board with heat sink to chassis attachment

US11842943B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Barrett M. Faneuf · Lakewood, US
Phil Geng · Washougal, US
Kenan Arik · Hillsboro, US
David Shia · Portland, US
Casey Winkel · Tumwater, US
Sandeep Ahuja · University Place, US
Eric D. McAfee · Portland, US
Jeffory L. Smalley · East Olympia, US
Minh T. D. Le · North Plains, US
Ralph V. Miele · Hillsboro, US
Marc Milobinski · Scappoose, US
Aaron P. Anderson · Beaverton, US
Brendan T. Pavelek · Portland, US
Fernando Gonzalez Lenero · Zapopan, MX
Carlos Alvizo Flores · Guadalajara, MX

Key dates

Filing date	Aug 5, 2020
Grant date	Dec 12, 2023
Priority date	—
Expiry date	Mar 14, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2023/4087
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.