Patent · US Active

Active thermal interposer device

US11846669B2 · kind B2 · utility

0Cited by
57References
29Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 15, 2022
Grant dateDec 19, 2023
Priority date
Expiry dateJun 15, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2868
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.