Active thermal interposer device
US11846669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2022 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Jun 15, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2868
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.