Method of manufacturing a semiconductor package
US11848301B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2023 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Mar 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.