Wafer inspection method and apparatus thereof
US11852465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2022 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Feb 11, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The disclosure provides a wafer inspection method and wafer inspection apparatus. The method includes: receive scanning information of at least one wafer, wherein the scanning information includes a plurality of haze values; the scanning information is divided into a plurality of information blocks according to the unit block, and the feature value of each of the plurality of information blocks is calculated according to the plurality of haze values included in each of the plurality of information blocks; and converting the feature value into a color value according to the haze upper threshold and the haze lower threshold, generating the color value corresponding to the at least one wafer according to the converted color value according to the feature value, whereby the color graph displays the texture content of the at least one wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.