Material analysis method
US11859965B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | May 4, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Sep 8, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2223/6116
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A material analysis method is provided. A plurality of wafers processed from a plurality of ingots are measured by a measuring instrument to obtain an average of a bow of each of the wafers processed from the ingots and a plurality of full widths at half maximum (FWHM) of each of the wafers. Key factors respectively corresponding to the ingots are calculated according to the FWHM of the wafers. A regression equation is obtained according to the key factors and the average of the bows.
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