Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking
US11862497B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Jan 31, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/5444
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.