Patent · US Active

Fluid-cooled package having shielding layer

US11862533B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Grassmann · Villach, AT
Wolfram Hable · Dresden, DE
Juergen Hoegerl · Regensburg, DE
Ivan Nikitin · Regensburg, DE
Achim Strass · Munich, DE

Key dates

Filing date	Dec 21, 2021
Grant date	Jan 2, 2024
Priority date	—
Expiry date	Jan 20, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package includes: at least one electronic chip; an encapsulant encapsulating at least part of the at least one electronic chip; a shielding layer on at least part of an external surface of the encapsulant; and a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid. The encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body. The surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid. The shielding layer covers the surface portion of the encapsulant. A corresponding electronic device, method of manufacturing the package, method of manufacturing the electronic device, vehicle, and method of using the electronic device are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.