Liquid supply unit, and apparatus and method for processing substrate
US11869778B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2020 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Apr 27, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F1/484
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
An apparatus for processing a substrate includes a housing, a support unit that supports the substrate in the housing, a nozzle that dispenses a processing liquid onto the substrate, and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes a container having a storage space in which the processing liquid is stored, a liquid supply tube through which the processing liquid flows from the container to the nozzle, and an ultrasonic-wave application member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic-wave application member includes a liquid reservoir having an interior space in which a liquid is received and an ultrasonic generator that applies ultrasonic waves to the liquid received in the liquid reservoir. Part of the liquid supply tube is immersed in the liquid received in the liquid reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.