Asymmetry correction via oriented wafer loading
US11869815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2022 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Mar 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.