Eric Lau
12Patents
2h-index
29Co-inventors
46Inventor score
Filing activity: Jul 17, 2014 → Mar 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11400560B2 | Retaining ring design | Electricity | 4 | Active |
| US10589399B2 | Textured small pad for chemical mechanical polishing | Performing Operations; Transporting | 2 | Active |
| US10076817B2 | Orbital polishing with small pad | Performing Operations; Transporting | 2 | Active |
| US10256111B2 | Chemical mechanical polishing automated recipe generation | Electricity | 2 | Active |
| US11282755B2 | Asymmetry correction via oriented wafer loading | Electricity | 1 | Active |
| US11931853B2 | Control of processing parameters for substrate polishing with angularly distributed zones using cost function | Electricity | 1 | Active |
| US9873179B2 | Carrier for small pad for chemical mechanical polishing | Performing Operations; Transporting | 0 | Active |
| US11869815B2 | Asymmetry correction via oriented wafer loading | Electricity | 0 | Active |
| US10434623B2 | Local area polishing system and polishing pad assemblies for a polishing system | Performing Operations; Transporting | 0 | Active |
| US11764069B2 | Asymmetry correction via variable relative velocity of a wafer | Electricity | 0 | Active |
| US12343840B2 | Control of processing parameters for substrate polishing with substrate precession | Electricity | 0 | Active |
| US10610994B2 | Polishing system with local area rate control and oscillation mode | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.