Patent · US Active

Semiconductor package and clip with a die attach

US11869830B2 · kind B2 · utility

0Cited by

10References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Stadler · Munich, DE
Thomas Bemmerl · Schwandorf, DE

Key dates

Filing date	Nov 8, 2019
Grant date	Jan 9, 2024
Priority date	—
Expiry date	Jan 15, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A clip, a semiconductor package, and a method are disclosed. In one example the clip includes a die attach portion having a first main face and a second main face opposite to the first main face, and at least one through-hole extending between the first and second main faces and including a curved transition from an inner wall of the at least one through-hole to the first main face.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.