Patent · US Active

Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof

US11869865B2 · kind B2 · utility

0Cited by

6References

7Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Bemmerl · Schwandorf, DE
Chooi Mei Chong · Melaka City, MY
Edward Myers · Munich, DE
Michael Stadler · Munich, DE

Key dates

Filing date	Jul 30, 2021
Grant date	Jan 9, 2024
Priority date	—
Expiry date	Mar 3, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3656
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.