Patent · US Active

Package with electrically insulated carrier and at least one step on encapsulant

US11876028B2 · kind B2 · utility

1Cited by

5References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Chii Shang Hong · Melaka City, MY
Teck Sim Lee · Melaka City, MY
Bernd Schmoelzer · Radenthein, AT
Ke Yan Tean · Melaka City, MY
Lee Shuang Wang · Melaka City, MY

Key dates

Filing date	Oct 15, 2021
Grant date	Jan 16, 2024
Priority date	—
Expiry date	Jan 6, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.