Substrate processing apparatus and apparatus for manufacturing integrated circuit device
US11887868B2 · kind B2 · utility
0Cited by
19References
17Claims
0Family size
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Key dates
| Filing date | Mar 29, 2021 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Jun 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.