Package structure with interposer encapsulated by an encapsulant
US11887928B2 · kind B2 · utility
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7Claims
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Assignee
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Key dates
| Filing date | Dec 17, 2021 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Apr 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68359
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.