Inventor

Teck-Chong Lee

40Patents
4h-index
40Co-inventors
59Inventor score

Filing activity: Dec 28, 2006 → Aug 29, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9837352B2 Semiconductor device and method for manufacturing the same Electricity 37 Active
US8853819B2 Semiconductor structure with passive element network and manufacturing method thereof Electricity 8 Active
US7614888B2 Flip chip package process Electricity 6 Active
US10475718B2 Semiconductor device package comprising a dielectric layer with built-in inductor Electricity 4 Active
US7547575B2 Two-stage die-bonding method for simultaneous die-bonding of multiple dies Emerging Cross-Sectional Technologies 4 Active
US7445944B2 Packaging substrate and manufacturing method thereof Electricity 3 Active
US9577027B2 Semiconductor device and process of making the same Electricity 2 Active
US11133423B2 Optical device and method of manufacturing the same Electricity 2 Active
US11011496B2 Semiconductor device packages and methods of manufacturing the same Electricity 2 Active
US7581666B2 Wire-bonding method for wire-bonding apparatus Emerging Cross-Sectional Technologies 1 Active
US11742324B2 Semiconductor device packages and methods of manufacturing the same Electricity 1 Active
US8415790B2 Semiconductor package having passive device and method for making the same Electricity 1 Active
US8368173B2 Semiconductor package and method for making the same Electricity 1 Active
US11276620B2 Package structure and method for manufacturing the same Electricity 1 Active
US10490341B2 Electrical device Electricity 1 Active
US11508655B2 Semiconductor package structure and method for manufacturing the same Electricity 1 Active
US8274133B2 Semiconductor package and method for making the same Electricity 1 Active
US9929132B2 Semiconductor device and process of making the same Electricity 0 Active
US11887928B2 Package structure with interposer encapsulated by an encapsulant Electricity 0 Active
US11894317B2 Package structure and method for manufacturing the same Electricity 0 Active
US11545427B2 Capacitor bank structure and semiconductor package structure Electricity 0 Active
US12300602B2 Semiconductor package structure and method for manufacturing the same Electricity 0 Active
US10741523B2 Semiconductor package device and method of manufacturing the same Electricity 0 Active
US11495572B2 Semiconductor package device and method of manufacturing the same Electricity 0 Active
US11764311B2 Optical device and electronic device Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.