Microelectronic device with embedded die substrate on interposer
US11894311B2 · kind B2 · utility
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30References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 8, 2022 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Apr 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92244
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. In the device, all additional routing may be allocated to the interposer to which the embedded die substrate is attached. The embedded die substrate may be formed with a planarized dielectric formed over an initial metallization layer supporting the embedded die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.