Package structure and method for manufacturing the same
US11894317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2020 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Oct 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.