Vertical semiconductor device with side grooves
US11894343B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2021 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Jun 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/182
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is vertically mounted on a medium such as a printed circuit board (PCB). The semiconductor device comprises a block of semiconductor dies, mounted in a vertical stack without offset. Once formed and encapsulated, side grooves may be formed in the device exposing electrical conductors of each die within the device. The electrical conductors exposed in the grooves mount to electrical contacts on the medium to electrically couple the semiconductor device to the medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.