Xianlu Cui
3Patents
0h-index
6Co-inventors
24Inventor score
Filing activity: Nov 30, 2020 → Dec 2, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11756932B2 | Sloped interconnector for stacked die package | Electricity | 0 | Active |
| US11894343B2 | Vertical semiconductor device with side grooves | Electricity | 0 | Active |
| US12083715B2 | Mold compound dispensing system and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.