Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing
US11904431B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Oct 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for insitu adjustment of wafer slip detection during work piece polishing are disclosure. In one aspect, a chemical mechanical planarization (CMP) system, includes: a carrier configured to retain a substrate, a platen supporting a polishing pad, and a slip sensor configured to generate a signal indicative of a characteristic of a surface of the polishing pad. The system further includes a processor configured to: receive the signal from the slip sensor, calibrate a steady-state value of the signal when the CMP system is in a steady-state condition, compare the signal received from the slip sensor to the calibrated steady-state value during CMP polishing, and detect wafer slip in response to the signal received from the slip sensor during the CMP polishing differing from the calibrated steady-state value by more than a threshold value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.