Film deposition apparatus and film deposition method
US11905595B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Jul 18, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film deposition apparatus includes a rotary table disposed in a vacuum chamber; multiple stages on each of which a substrate is placeable, the stages being arranged along a circumferential direction of the rotary table; a process area configured to supply a process gas toward an upper surface of the rotary table; a heat treatment area that is disposed apart from the process area in the circumferential direction of the rotary table and configured to heat-treat the substrate at a temperature higher than a temperature used in the process area; and a cooling area that is disposed apart from the heat treatment area in the circumferential direction of the rotary table and configured to cool the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.