Organic film forming apparatus
US11906246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2020 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Aug 12, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1303
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.