Patent · US Active

Device and method for tuning plasma distribution using phase control

US11908662B2 · kind B2 · utility

0Cited by

8References

14Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Xiaopu Li · San Jose, US
Kallol Bera · San Jose, US
Edward P. Hammond, IV · Hillsborough, US
Jonghoon Baek · San Jose, US
Amit Kumar BANSAL · Milpitas, US
Jun Ma · 流花街道, CN
Satoru Kobayashi · Tokyo, JP

Key dates

Filing date	Oct 24, 2019
Grant date	Feb 20, 2024
Priority date	—
Expiry date	Nov 21, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/3321
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Embodiments described herein relate to apparatus and techniques for radio frequency (RF) phase control in a process chamber. A process volume is defined in the process chamber by a faceplate electrode and a support pedestal. A grounding bowl is disposed within the process chamber about the support pedestal opposite the process volume. The grounding bowl substantially fills a volume other than the process volume below the support pedestal. A phase tuner circuit is coupled to an RF mesh disposed in the support pedestal and the faceplate electrode. The tuner circuit adjusts a phase difference between a phase of the faceplate electrode and a phase of the RF mesh.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.