Patent · US Active

Method and device for plating a recess in a substrate

US11908698B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

SEMSYSCO GMBH · AT

Inventors

Franz Markut · St. Georgen, AT
Thomas Wirnsberger · Seeboden, AT
Oliver Knoll · Salzburg, AT
Andreas Gleissner · Radenthein, AT
Harald Okorn-Schmidt · Putnam Valley, US
Philipp Engesser · Villach, AT

Key dates

Filing date	Oct 1, 2021
Grant date	Feb 20, 2024
Priority date	—
Expiry date	Mar 2, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76898
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.