Dynamic temperature control of substrate support in substrate processing system
US11908715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Dec 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B1/0233
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A temperature-controlled substrate support for a substrate processing system includes a substrate support located in the processing chamber. The substrate support includes N zones and N resistive heaters, respectively, where N is an integer greater than one. A temperature sensor is located in one of the N zones. A controller is configured to calculate N resistances of the N resistive heaters during operation and to adjust power to N−1 of the N resistive heaters during operation of the substrate processing system in response to the temperature measured in the one of the N zones by the temperature sensor, the N resistances of the N resistive heaters, and N−1 resistance ratios.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.