Image-based in-situ process monitoring
US11908716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Oct 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for monitoring etch or deposition processes using image-based in-situ process monitoring techniques include illuminating a measurement area on a sample disposed in a process chamber. The measurement area is illuminated using an input beam generated remote from the process chamber and transmitted to a first viewing window of the process chamber by a first optical fiber. Portions of the first input beam reflected from the measurement area are transmitted from the first viewing window to an imaging sensor by a second optical fiber. A sequence of images is obtained at the imaging sensor, and a change in reflectance of pixels within each of the images is determined. The etch or deposition process is monitored based on the change in reflectance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.