Flexible clip with aligner structure
US11908826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Aug 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/90
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A clip preform includes a die contact portion and an aligner structure. An intermediate portion connects the die contact portion to a lead contact portion in the aligner structure. The die contact portion is configured to contact a semiconductor die. The aligner structure is configured to attach the lead contact portion to a lead post. The die contact portion, the intermediate portion, and the aligner structure form a structure of a primary clip for connecting the semiconductor die to the lead post. The clip preform is severable by removing parts of the die contact portion and the intermediate portion of the clip preform to form a secondary clip for connecting the semiconductor die to the lead post. The aligner structure, a remaining part of the die contact portion, and a remaining part of the intermediate portion of the clip preform form a structure of the secondary clip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.