Patent · US Active

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

US11915999B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Tomasz Naeve · Finkenstein, AT
Ralf Otremba · Kaufbeuren, DE
Thorsten Scharf · Regensburg, DE
Markus Dinkel · Unterhaching, DE
Martin Gruber · Schwandorf, DE
Elvir Kahrimanovic · Villach, AT

Key dates

Filing date	Jan 31, 2023
Grant date	Feb 27, 2024
Priority date	—
Expiry date	Jan 31, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH02P2201/03
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes: a carrier including an electronic circuit; a plurality of semiconductor chip packages mounted on the carrier, each of the chip packages including an encapsulation encapsulating the semiconductor chip, a plurality of contact structures electrically connecting the semiconductor chip with the electronic circuit, and at least one cooling structure protruding from the encapsulation; and a cooling element thermally conductively connected to at least one cooling structure of each of at least two of the plurality of semiconductor chip packages.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.