Varied ball ball-grid-array (BGA) packages

US11916003B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Xiao Lu · Jiangmen, CN
• Jiongxin Lu · Cupertino, US
• Christopher Combs · Portland, US
• Alexander HUETTIS · Beaverton, US
• John Harper · King of Prussia, US
• Jieping Zhang · Mesa, US
• Nachiket R. Raravikar · Chandler, US
• Pramod Malatkar · Chandler, US
• Steven A. Klein · Chandler, US
• Carl Deppisch · Chandler, US
• Mohit Sood · Chandler, US

Key dates

• Filing date: Sep 18, 2019
• Grant date: Feb 27, 2024
• Expiry date: Dec 31, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.