Substrate heating unit, substrate processing apparatus, and substrate processing method
US11923213B2 · kind B2 · utility
1Cited by
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17Claims
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Key dates
| Filing date | Dec 20, 2020 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Apr 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31111
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.