Apparatus for treating substrate
US11923219B2 · kind B2 · utility
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2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Jan 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.