Hybrid microelectronic substrates
US11923257B2 · kind B2 · utility
1Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Apr 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.