Patent · US Active

Patternable die attach materials and processes for patterning

US11923312B2 · kind B2 · utility

0Cited by

0References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bai Nie · Chandler, US
Gang Duan · Beijing, CN
Srinivas V. Pietambaram · Gilbert, US
Jesse C. Jones · Chandler, US
Yosuke Kanaoka · Phoenix, US
Hongxia Feng · Chandler, US
Dingying Xu · Chandler, US
Rahul N. Manepalli · Chandler, US
Sameer Paital · Chandler, US
Kristof Darmawikarta · Chandler, US
Yonggang Li · Chandler, US
Meizi Jiao · Chandler, US
Chong Zhang · Chandler, US
Matthew Tingey · Hillsboro, US
Jung Kyu Han · Chandler, US
Haobo Chen · Chandler, US

Key dates

Filing date	Mar 27, 2019
Grant date	Mar 5, 2024
Priority date	—
Expiry date	Apr 19, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/381
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.