Substrate processing apparatus and method of fabricating semiconductor device using the same
US11927890B1 · kind B1 · utility
0Cited by
4References
16Claims
0Family size
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Key dates
| Filing date | Aug 22, 2022 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.