Package structure and method of forming the same
US11929318B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.