Nano copper paste and film for sintered die attach and similar applications
US11929341B2 · kind B2 · utility
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2References
8Claims
0Family size
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Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jun 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.