Folding thermal ground plane
US11930621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Dec 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20318
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.