Modular mainframe layout for supporting multiple semiconductor process modules or chambers

US11935770B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Randy Harris · Kalispell, US
• Coby Scott GROVE · Columbia Falls, US
• Paul Z. Wirth · Kalispell, US
• Avinash SHANTARAM · Whitefish, US
• Alpay Yilmaz · San Jose, US
• Amir NISSAN · Sunnyvale, US
• Vincent DiCaprio · Pleasanton, US

Key dates

• Filing date: Feb 17, 2021
• Grant date: Mar 19, 2024
• Expiry date: Feb 17, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68707
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.