Coby Scott GROVE
5Patents
2h-index
16Co-inventors
48Inventor score
Filing activity: Jun 9, 1998 → Dec 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6030208A | Thermal processor | Electricity | 19 | Expired |
| US6930046B2 | Single workpiece processing system | Emerging Cross-Sectional Technologies | 12 | Expired |
| US11935770B2 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Electricity | 0 | Active |
| US11984335B2 | FOUP or cassette storage for hybrid substrate bonding system | Electricity | 0 | Active |
| US11935771B2 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.