Modular mainframe layout for supporting multiple semiconductor process modules or chambers

US11935771B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Randy Harris · Kalispell, US
• Coby Scott GROVE · Columbia Falls, US
• Paul Z. Wirth · Kalispell, US
• Avinash SHANTARAM · Whitefish, US
• Alpay Yilmaz · San Jose, US
• Amir NISSAN · Sunnyvale, US
• Jitendra Ratilal BHIMJIYANI · Santa Clara, US
• Niranjan PINGLE · Milpitas, US
• Vincent DiCaprio · Pleasanton, US

Key dates

• Filing date: Oct 28, 2021
• Grant date: Mar 19, 2024
• Expiry date: Jun 29, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/95053
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.