Patent · US Active

Linear spacer for spacing a carrier of a package

US11942383B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Chii Shang Hong · Melaka City, MY
Teck Sim Lee · Melaka City, MY
Ralf Otremba · Kaufbeuren, DE
Daniel Pedone · Munich, DE
Bernd Schmoelzer · Radenthein, AT

Key dates

Filing date	Oct 14, 2021
Grant date	Mar 26, 2024
Priority date	—
Expiry date	Aug 5, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3421
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package for mounting on a mounting base is disclosed. In one example, the package comprises a carrier, an electronic component mounted at the carrier, leads electrically coupled with the electronic component and to be electrically coupled with the mounting base, and a linear spacer for defining a spacing with respect to the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.