Embedded structure, manufacturing method thereof and substrate
US11942465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2021 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jul 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/2101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a manufacturing method for an embedded structure. The method includes: preparing a temporary carrier board; preparing a second circuit layer on at least one of the upper surface and the lower surface of the temporary carrier board, and preparing a first dielectric layer to cover the second circuit layer; patterning and curing the first dielectric layer to form a cavity, mounting a device in the cavity, and performing hot-curing, wherein a surface of the device provided with a terminal faces an opening of the cavity; and preparing a second dielectric layer, wherein the device is embedded in the second dielectric layer, and a surface of the second dielectric layer is higher than a surface of the terminal by a preset value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.